SERVER
2U Flagship Versatile Server
R825
The R825 is a premium 2U rack server powered by 4th/5th Gen Intel® Xeon® Scalable processors, boasting robust performance and stable operation. Designed specifically for flexible resource allocation to meet diverse industry demands, it stands out in core application fields such as cloud computing, HPC, cloud storage, big data, virtualization, enterprise systems, and beyond.
Products Specification
| Model | R825 |
| Processor | Supports 2*4th/5th Gen Intel Xeon® Scalable Processors (TDP 385W) |
| Memory | Up to 32*DDR5 slots, up to 5600MHz |
| RAID Controller | The onboard RAID controller features cache supercapacitor protection, supporting RAID level migration, disk roaming, self-diagnosis, web remote management and RAID secure boot |
| Storage | Up to 12*3.5″ or 28*2.5″ drives (24*NVMe compatible)Internal: 2*SATA/PCIe M.2Onboard supports for 16*SATA drives (no external controller required) |
| Network Interface | 1*OCP 3.0 slot with NCSIOptional interfaces: 2*GE, 2*10GE, 2*25GE, 2*100GE, 2*200GE |
| PCIe Expansion | Up to 8*PCIe 5.0 slots + 1*OCP 3.0 slot |
| Additional Interfaces | Rear: 1*RJ-45 management port, 2*USB 3.0, 1*VGAFront:2*USB 3.0 + VGA |
| Power Supply | Supports 1300W/2000W CRPS Titanium/Platinum PSU (hot-swappable, 1+1 redundant) Voltage: 100-240V AC (refer to nameplate) |
| Fan | 6*hot-swappable fans (N+2 redundancy) |
| Management | Integrated BMC with 1Gbps RJ-45 portSupports Redfish, SNMP, IPMI 2.0, HTML5/iKVM remote controlBMC dual-flash backup |
| OS Support | Windows Server, RHEL, SLES, CentOS, Ubuntu, VMware ESXi, etc. |
| Operating Temperature | 5°C ~ 45°C |
| Chassis Dimensions | 770mm (L)* 482mm (W) *87mm (H) |
| Packaging Dimensions | 1000mm (L)*600mm (W)*260mm (H) |
| Weight | Max 40kg (varies by configuration) |
Products Views
Products Features
- High-Density Computing Power
- Engineered for extreme density: 2*385W CPUs plus 32*DDR5 DIMMs integrated in a slim 2U form factor. Accelerate application performance with enhanced high-speed connectivity. Flexible scalability is guaranteed by versatile OCP NICs and PCIe 5.0 slots, boosting transmission speeds by 100%.
- High Reliability and Security
- Delivering 50% higher heat dissipation efficiency compared with single heat sink solutions. Adopting remote heat pipe cooling technology, it ensures reliable thermal dissipation and superior temperature adaptability. Cutting system downtime by 66%, the proprietary AI-powered memory fault self-healing technology guarantees uninterrupted, stable system operation.
- Efficient Energy Saving
- Industry-leading power supply technology for higher efficiency, it delivers an industry-top power conversion rate, with power loss 12.5% lower than the industry average, cutting overall energy consumption by up to 8% versus standard industry solutions.Proprietary smart algorithms minimize power draw for fans and CPUs to further reduce energy use.
- Intelligent O&M
- Delivering 20× higher upgrade efficiency, the tool-free design enables fast component assembly and disassembly to shorten O&M time. Out-of-band visual management supports precise remote localization of physical device status and information, enabling intelligent full-lifecycle services for the product.